JPS59993A - 金属板電極接合方法 - Google Patents

金属板電極接合方法

Info

Publication number
JPS59993A
JPS59993A JP11016082A JP11016082A JPS59993A JP S59993 A JPS59993 A JP S59993A JP 11016082 A JP11016082 A JP 11016082A JP 11016082 A JP11016082 A JP 11016082A JP S59993 A JPS59993 A JP S59993A
Authority
JP
Japan
Prior art keywords
metal plate
thin film
electrode
plate electrode
solder layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11016082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS643333B2 (en]
Inventor
元次 志賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP11016082A priority Critical patent/JPS59993A/ja
Publication of JPS59993A publication Critical patent/JPS59993A/ja
Publication of JPS643333B2 publication Critical patent/JPS643333B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP11016082A 1982-06-25 1982-06-25 金属板電極接合方法 Granted JPS59993A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11016082A JPS59993A (ja) 1982-06-25 1982-06-25 金属板電極接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11016082A JPS59993A (ja) 1982-06-25 1982-06-25 金属板電極接合方法

Publications (2)

Publication Number Publication Date
JPS59993A true JPS59993A (ja) 1984-01-06
JPS643333B2 JPS643333B2 (en]) 1989-01-20

Family

ID=14528565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11016082A Granted JPS59993A (ja) 1982-06-25 1982-06-25 金属板電極接合方法

Country Status (1)

Country Link
JP (1) JPS59993A (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63220501A (ja) * 1987-03-09 1988-09-13 東京コスモス電機株式会社 電子部品
JPH0243017U (en]) * 1988-09-16 1990-03-26
JPH02156606A (ja) * 1988-12-09 1990-06-15 Murata Mfg Co Ltd リード線の接続構造
JPH03239314A (ja) * 1990-02-17 1991-10-24 Tdk Corp インダクタンスコイル及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63220501A (ja) * 1987-03-09 1988-09-13 東京コスモス電機株式会社 電子部品
JPH0243017U (en]) * 1988-09-16 1990-03-26
JPH02156606A (ja) * 1988-12-09 1990-06-15 Murata Mfg Co Ltd リード線の接続構造
JPH03239314A (ja) * 1990-02-17 1991-10-24 Tdk Corp インダクタンスコイル及びその製造方法

Also Published As

Publication number Publication date
JPS643333B2 (en]) 1989-01-20

Similar Documents

Publication Publication Date Title
CN102593020B (zh) 制造半导体设备的方法、半导体设备以及使用该半导体设备的点火器
JPH04192596A (ja) 電子部品の表面実装構造
JPH11251176A (ja) セラミック電子部品
JP3456454B2 (ja) ワイヤを有する電子部品
JP3552189B2 (ja) ワイヤを有する電子部品
JPS59993A (ja) 金属板電極接合方法
JPS58112321A (ja) チツプ状固体電解コンデンサの製造法
JP3627745B2 (ja) ワイヤを有する電子部品
JPH0528752Y2 (en])
CN216749608U (zh) 一种贴片电容
JPH02156606A (ja) リード線の接続構造
JPS6222278B2 (en])
US5537739A (en) Method for electoconductively connecting contacts
KR102065765B1 (ko) 솔더범프를 이용한 반도체칩의 단자 접합방법
JP2594627Y2 (ja) 電子部品の端子パターン部
JP2002368038A (ja) フリップチップ実装方法
JPS60213017A (ja) チツプ状固体電解コンデンサ
JPS58102596A (ja) 金属芯印刷配線板
JPH07169908A (ja) はんだ付け方法、半導体装置の製造方法及び複合はんだ板
JPH04356935A (ja) 半導体装置のバンプ電極形成方法
JPH05259632A (ja) プリント配線板およびその製造方法
JPH0426199A (ja) 多層基板の実装構造
JPH0744199B2 (ja) 半導体装置の実装体およびその実装方法
JPH0794035A (ja) 中継接続用テープ電線
JP2002353394A (ja) ピン付き配線基板およびこれを用いた電子装置